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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FPC080P040-S | Chip Quik Inc. | 5000 | - |
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FPC/FFC SMT CONN STENCIL |
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PA0045-S | Chip Quik Inc. | 5000 | - |
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VSOP-16 STENCIL |
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PA0046-S | Chip Quik Inc. | 5000 | - |
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VSOP-24 STENCIL |
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PA0047-S | Chip Quik Inc. | 5000 | - |
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VSOP-28 STENCIL |
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PA0043-S | Chip Quik Inc. | 5000 | - |
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VSOP-8 STENCIL |
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PA0044-S | Chip Quik Inc. | 5000 | - |
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VSOP-8 STENCIL |
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PA0208-S | Chip Quik Inc. | 5000 | - |
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TSOP-48 STENCIL |
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PA0059-S | Chip Quik Inc. | 5000 | - |
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QFN-14 STENCIL |
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IPC0151-S | Chip Quik Inc. | 5000 | - |
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MSOP-12 (0.65MM PITCH, 4X3MM BOD |
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IPC0154-S | Chip Quik Inc. | 5000 | - |
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QFN-12/LFCSP-12 (0.4MM PITCH, 2X |
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IPC0155-S | Chip Quik Inc. | 5000 | - |
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DFN-12 (0.4MM PITCH, 3X3MM BODY) |
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IPC0156-S | Chip Quik Inc. | 5000 | - |
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TSSOP-44 (0.64MM PITCH, 14X6.1MM |
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IPC0157-S | Chip Quik Inc. | 5000 | - |
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DFN-10 (0.4MM PITCH, 2X2MM BODY) |
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IPC0158-S | Chip Quik Inc. | 5000 | - |
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QFN-24/LFCSP-24 (0.5MM PITCH, 5X |
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IPC0159-S | Chip Quik Inc. | 5000 | - |
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DFN-22 (0.5MM PITCH, 6X3MM BODY) |
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IPC0160-S | Chip Quik Inc. | 5000 | - |
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MQFP-44 (0.8MM PITCH, 10X10MM BO |
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IPC0161-S | Chip Quik Inc. | 5000 | - |
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LGA-10 (0.65MM PITCH, 3X3MM BODY |
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IPC0162-S | Chip Quik Inc. | 5000 | - |
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SSOP-24 (1MM PITCH, 13X6MM BODY) |
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IPC0163-S | Chip Quik Inc. | 5000 | - |
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SOIC-32 (1.27MM PITCH, 20.4X11.3 |
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IPC0164-S | Chip Quik Inc. | 5000 | - |
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DFN-8 (0.45MM PITCH, 2X3MM BODY) |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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