Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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TISP4S260M3BJR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 190V 50A DO214AA |
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TISP4S300M3BJR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 220V 50A DO214AA |
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TISP4S350M3BJR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 275V 50A DO214AA |
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TISP4S350T3BJR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 275V 80A DO214AA |
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TISP4S400M3BJR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 300V 50A DO214AA |
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TISP3260F3DR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 200V 175A 8SOIC |
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TISP3320F3DR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 240V 175A 8SOIC |
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TISP4220M3LMFR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 160V 220A TO226-2 |
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9EL3 | Bourns Inc. | 5000 | - |
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THYRISTOR 245V 100A BUTTON |
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TISP2082F3DR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 66V 70A 8SOIC |
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TISP2125F3DR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 100V 120A 8SOIC |
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TISP2180F3DR-S | Bourns Inc. | 5000 | - |
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THYRISTOR 145V 120A 8SOIC |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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