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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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CLM/P-PQ32/30 | Ferroxcube | 5000 | - |
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U SHAPED CLIP |
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CLM/S-P26/16-C | Ferroxcube | 5000 | - |
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U SHAPED CLIP |
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B66308B1108T001 | EPCOS - TDK Electronics | 5000 | - |
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BOBBIN COIL FORMER E 16 X 8 X 5 |
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VTM120-4 | Lodestone Pacific | 5000 | - |
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1.2" MAX INDUCTOR DIA-VERTICAL T |
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B65804C2005X000 | EPCOS - TDK Electronics | 5000 | - |
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INSULATING WASHER RM 4 |
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9677242409 | Fair-Rite Products Corp. | 5000 | - |
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77 BOBBIN 3PC. ASSEMBLY |
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B66422W1010D001 | EPCOS - TDK Electronics | 5000 | - |
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BOBBIN COIL FORMER EFD 25X13X9 |
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PC166-6/170 | Lodestone Pacific | 5000 | - |
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COVER CUP FOR STM166-6 |
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B65820B2001X000 | EPCOS - TDK Electronics | 5000 | - |
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CLAMP RM 7 |
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CPV-P18/11-3S-6PD-Z | Ferroxcube | 5000 | - |
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COIL FORMER VERTICAL |
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B66398A2000X000 | EPCOS - TDK Electronics | 5000 | - |
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YOKE ETD 59 X 31 X 22 |
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TR80-B | Lodestone Pacific | 5000 | - |
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.80" MAX INDUCTOR DIA-HORIZONTAL |
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CLI-E25/13/7 | Ferroxcube | 5000 | - |
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CLIP |
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CPV-P18/11-2S-6PD-Z | Ferroxcube | 5000 | - |
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COIL FORMER VERTICAL |
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CPV-PQ20/20-1S-14PD-Z | Ferroxcube | 5000 | - |
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COIL FORMER VERTICAL |
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TM450-6 | Lodestone Pacific | 5000 | - |
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.450" MAX INDUCTOR DIA-HORIZONTA |
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B64292A1004X000 | EPCOS - TDK Electronics | 5000 | - |
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HOUSING VERTICAL TOROIDS |
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9677282008 | Fair-Rite Products Corp. | 5000 | - |
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77 BOBBIN 3PC. ASSEMBLY COATED |
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B66424W1012D001 | EPCOS - TDK Electronics | 5000 | - |
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BOBBIN COIL FORMER EFD 30X15X9 |
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KM68-02 | Lodestone Pacific | 5000 | - |
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.68" MAX INDUCTOR DIA-VERTICAL K |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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