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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FFS.4A.161.DA | LEMO | 5000 | - |
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CRIMP FERRULE FOR FFS.4A. |
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796260-6 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COUNTER NUT 23 GRAY |
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5204-0009-75 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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983-4R-D 22 | TE Connectivity Deutsch Connectors | 5000 | - |
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983-4R-D 22 |
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FGG.4B.132.LC | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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025-0503-000 | ITT Cannon, LLC | 5000 | - |
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CONN PROTECTIVE COVER 36 RED |
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FGG.3B.132.LC | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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VS151134 | Radiall USA, Inc. | 5000 | - |
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CVB 043-32 F16 |
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FGG.00.130.LD | LEMO | 5000 | - |
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CONN BACK-NUT COLLET |
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796257-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SEALING WASHER 11 BLACK |
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5204-0009-90 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED FLOUROSILICONE FLANG |
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DM9701-19A | TE Connectivity Deutsch Connectors | 5000 | - |
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DUST CAP |
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MP-738-61S | Amphenol Sine Systems Corp | 5000 | - |
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DUST CAP FOR MP-6212-61S |
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980-8552-000 | ITT Cannon, LLC | 5000 | - |
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CONN SEALING RING 14S BLACK |
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5204-0025-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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VS151122 | Radiall USA, Inc. | 5000 | - |
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CVB 043-32 F4 |
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FGG.00.155.LNN | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FGG.00. |
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796255-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SEALING WASHER 13 BLACK |
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5204-0010-10 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG/CU FILLED SILICONE FLANGE MOU |
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PVS81-16NA | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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