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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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D3899932F15N | Amphenol PCD | 5000 | - |
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CONN PROTECTIVE COVER 15 SILVER |
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075-8520-000 | ITT Cannon, LLC | 5000 | - |
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CONN FLANGE GASKET 28 BLACK |
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5204-0027-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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BFL.2K.100.NAS | LEMO | 5000 | - |
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CONN COVER SILVER |
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FGG.00.155.LNNP | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FGG.00. |
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796255-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SEALING WASHER 17 BLACK |
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5204-0010-15 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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D38999/33Z23R | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 23 RECEPTAC |
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025-0501-000 | ITT Cannon, LLC | 5000 | - |
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CONN DUST COVER 28 32 44 RED |
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MS27510Z20C | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 20 PLUG MIL |
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2157930-1 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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SZ 4 RECEPT DUST CAP |
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KPT81-8 | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
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FGG.0B.122.LN | LEMO | 5000 | - |
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LATCH SLEEVE FOR FGG.0B. |
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212435-7 | TE Connectivity AMP Connectors | 5000 | - |
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CONN FERRULE SILVER |
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5204-0010-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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1302011204 | WEC | 5000 | - |
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FORMED HOOK - GRY ANODIZE |
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025-0611-000 | ITT Cannon, LLC | 5000 | - |
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CONN DUST COVER 16 16S RED |
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MS27511Z16CL | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 16 RECEPTAC |
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BRE.3K.200.LN | LEMO | 5000 | - |
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CONN COVER SILVER |
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PVS15G12 | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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