Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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FGG.2B.130.LN | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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97-60-28P | Amphenol Industrial Operations | 5000 | - |
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CONN COVER 28 OLIVE |
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5204-0011-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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MS27502Z19NL | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 19 RECEPTAC |
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192900-0377 | ITT Cannon, LLC | 5000 | - |
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CONN DUST COVER 12 |
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BND-1425S | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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BND-1425S |
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BRE.0V.200.NAV | LEMO | 5000 | - |
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CONN COVER SILVER |
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1520-10-340812 | TE Connectivity AMP Connectors | 5000 | - |
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CONN ADAPTER KIT 20 |
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FGG.2B.150.LN | LEMO | 5000 | - |
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MIDPIECE FOR FGG.2B. |
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JR13-WCCA-4(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 BLACK |
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5204-0011-60 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED SILICONE FLANGE MOUN |
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MS3181-12CA | Amphenol PCD | 5000 | - |
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26482 D/C RECP SZ 12 BLK ANOD |
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075-8503-001 | WEC | 5000 | - |
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CONN FLANGE GASKET 14S BLACK |
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5204-0030-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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TR05AI-TINEL-LOCK-RING | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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TR05AI-TINEL-LOCK-RING |
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1300390379 | Molex | 5000 | - |
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DEVICENET THIN CABLE (25M) |
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FGG.2B.151.LN | LEMO | 5000 | - |
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MIDPIECE FOR FGG.2B. |
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JR13WCCA-5 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 BLACK |
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5204-0011-65 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG/NI FILLED SILICONE FLANGE MOU |
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5204-0032-50 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG/G FILLED SILICONE FLANGE MOUN |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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