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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FGG.2B.195.LN | LEMO | 5000 | - |
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FLUIDIC SLEEVE |
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JR13WCCA-8 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 BLACK |
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MS27501Z21CN | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 21 PLUG MIL |
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980-8554-002 | ITT Cannon, LLC | 5000 | - |
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CONN SEALING RING 18 BLACK |
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CIRP2821GPL | WEC | 5000 | - |
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CONN GROMMET GRAY |
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5204-0012-10 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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2101579-2 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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DUST CAP,RCPT,SZ105,F SERIES |
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MDGT-16 | Souriau-Sunbank by Eaton | 5000 | - |
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DAC-16 INCH GROUND TRACK |
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FGG.2G.150.LN | LEMO | 5000 | - |
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MIDPIECE FOR FGG.2G. |
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5204-0010-35 | Leader Tech Inc. | 5000 | - |
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AG FILLED FLOUROSILICONE FLANGE |
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JR13WCCA-9 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 BLACK |
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192900-0683 | ITT Cannon, LLC | 5000 | - |
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CONN DUST COVER 24 BLACK |
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5204-0012-15 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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D38999/22HZ | Amphenol PCD | 5000 | - |
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DUMMY RECEPTACLE SHELL SIZE 23 M |
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CS0095-000 | TE Connectivity AMP Connectors | 5000 | - |
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LOCK RING ADAPT |
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FGG.2G.151.LN | LEMO | 5000 | - |
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MIDPIECE FOR FGG.2G. |
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MC-000505-0MF-IS001 | Amphenol LTW | 5000 | - |
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MICRO-C INLINE RESISTOR |
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MS27502Z21CL | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 21 RECEPTAC |
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JR13WCCA-10 | Hirose Electric Co Ltd | 5000 | - |
Add To CartInquiry Now |
CONN STRAIN RELIEF 13 BLACK |
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075-8515-001 | ITT Cannon, LLC | 5000 | - |
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CONN FLANGE GASKET 16 16S BLACK |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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