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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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MS27502Z21N | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 21 RECEPTAC |
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VG95234KB22 | ITT Cannon, LLC | 5000 | - |
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CONN PROTECTIVE COVER 22 BLACK |
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5204-0014-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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FFA.3E.137.LCN | LEMO | 5000 | - |
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OVERSIZED COLLET ADPT FFA.3E. |
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FGW.3K.146.ZZA | LEMO | 5000 | - |
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ANCHOR W/SCREWS FOR FGW.3K. |
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JRC16RC | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 16 SILVER |
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5204-0026-65 | Leader Tech Inc. | 5000 | - |
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AG/NI FILLED SILICONE FLANGE MOU |
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1300700003 | Molex | 5000 | - |
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QC 4P M/F ST/ST SK 2.8M 10/4 |
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5204-0014-25 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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T04220609 | Amphenol Sine Systems Corp | 5000 | - |
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CONN HEX NUT DIN |
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5204-0014-45 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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983-3W-C 14 | TE Connectivity Deutsch Connectors | 5000 | - |
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983-3W-C 14 |
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FGW.3K.896.TN | LEMO | 5000 | - |
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T-ADAPTER 9.6 |
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RM15TP-C | Hirose Electric Co Ltd | 5000 | - |
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CONN DUST COVER 15 SILVER |
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5204-0001-20 | Leader Tech Inc. | 5000 | - |
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CONN EMI GASKET 6 BEIGE |
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1300700006 | Molex | 5000 | - |
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QC 4P M/F ST/ST SK 4M 10/4 SS |
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FGG.3B.711.DN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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JR13WCCA-4(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 BLACK |
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5204-0014-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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700-650-097-004-315 | ODU | 5000 | - |
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AMC HD MATT CHROME PROTECTIVE CA |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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