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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FGG.4K.100.LN | LEMO | 5000 | - |
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CONN COVER SILVER |
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JR21WCCA-14 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 21 BLACK |
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5204-0028-45 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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1300700002 | Molex | 5000 | - |
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QC 4P M/F ST/ST SK 1.8M 10/4 |
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5204-0013-55 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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237-0874-001 | ITT Cannon, LLC | 5000 | - |
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CONN POTTNG BOOT RING 10 11 OLIV |
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5204-0013-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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1590491 | Phoenix Contact | 5000 | - |
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CONN DUST COVER SILVER |
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FGG.4K.155.LNN | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FGG.4K. |
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JR21WCCA-16 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 21 BLACK |
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MS27510Z16CN | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 16 PLUG MIL |
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1814-10-130408 | TE Connectivity AMP Connectors | 5000 | - |
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KIT BOOT ADAPTER |
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0113-023-000 | WEC | 5000 | - |
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SPRING WAFER |
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980-8558-002 | ITT Cannon, LLC | 5000 | - |
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CONN SEALING RING 28 BLUE |
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5204-0013-60 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED SILICONE FLANGE MOUN |
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5204-0029-35 | Leader Tech Inc. | 5000 | - |
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AG FILLED FLOUROSILICONE FLANGE |
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FGG.5B.132.LC | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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JR25WCCA-8 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 25 BLACK |
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5204-0006-35 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG FILLED FLOUROSILICONE FLANGE |
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1516-10-341012 | TE Connectivity AMP Connectors | 5000 | - |
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CONN ADAPTER 16 |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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