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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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174528-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN 20POS COVER HSG S-MINI-MITE |
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1-2198618-5 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 15POS 45DEG SHLD |
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165X14579X | Conec | 5000 | - |
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CONN BACKSHELL 25POS 45DEG BLACK |
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10320-A200-00 | 3M | 5000 | - |
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CONN BACKSHELL 20POS 180DEG SHLD |
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8655MH1502BKLF | Amphenol CS (FCI) | 5000 | - |
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BACKSHELL DSUB |
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552008-4 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 50POS 180DEG GRAY |
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09670150426 | HARTING | 5000 | - |
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CONN BACKSHELL 15POS 180DEG BLK |
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DX30M-50-CV(10) | Hirose Electric Co Ltd | 5000 | - |
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CONN BACKSHELL 50POS 180DEG SHLD |
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863093CBCLF | Amphenol ICC (FCI) | 5000 | - |
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DSUB ACCY |
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959-009-030R121 | NorComp Inc. | 5000 | - |
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CONN BACKSHELL 9POS 45DEG |
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8655MH2512LF | Amphenol CS (FCI) | 5000 | - |
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BACKSHELL DSUB |
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10326-A200-00 | 3M | 5000 | - |
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CONN BACKSHELL 26POS 180DEG SHLD |
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8655MHRA2502LF | Amphenol CS (FCI) | 5000 | - |
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BACKSHELL DSUB |
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1731110592 | Molex | 5000 | - |
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FCT HOOD |
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09670090452 | HARTING | 5000 | - |
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DSUB PLAPC-HOOD 09P |
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1731110028 | Molex | 5000 | - |
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CONN BACKSHELL 50POS 180DEG BLK |
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229909-4 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 50POS 90DEG GRAY |
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165X02699X | Conec | 5000 | - |
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CONN BACKSHELL 15POS 45DEG SHLD |
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1731110736 | Molex | 5000 | - |
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FCT HOOD |
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10336-A200-00 | 3M | 5000 | - |
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CONN BACKSHELL 36POS 180DEG SHLD |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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