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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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863022BLF | Amphenol CS (FCI) | 5000 | - |
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CNR ACC PLASTIC |
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2198618-9 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 9P 45DEG SHLD SLV |
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1731110433 | Molex | 5000 | - |
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FCT HOOD |
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10368-A200-00 | 3M | 5000 | - |
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CONN BACKSHELL 68POS 180DEG SHLD |
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1731140263 | Molex | 5000 | - |
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FCT HOOD S1 0 DEG PLSTC |
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86303928ALF | Amphenol CS (FCI) | 5000 | - |
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CONN POTTING SHELL 37P 90DEG BLK |
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ACOV-SUB-15MB20 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 15P 45/180DEG SHD |
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ACOV-SUB-50NB13 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 50POS 180DEG GRAY |
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863027BLF | Amphenol ICC (FCI) | 5000 | - |
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DSUB HOOD POTING |
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61801525311 | Würth Elektronik | 5000 | - |
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WR-DSUB PLASTIC HOOD TOP ENTRY 4 |
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982-037-010R031 | NorComp Inc. | 5000 | - |
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CONN BACKSHELL 37P 90/180DEG GRY |
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103A0-A200-00 | 3M | 5000 | - |
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CONN BACKSHELL 100P 180DEG SHLD |
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1731110255 | Molex | 5000 | - |
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FCT HOOD S1 0 DEG SHLD PLSTC |
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SDH-H9BL | Cinch Connectivity Solutions | 5000 | - |
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CONN BACKSHELL 9POS 180DEG BLACK |
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ACOV-SUB-09MB1 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 9POS 180DEG SHLD |
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ACOV-SUB-50NB14 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 50POS 180DEG GRAY |
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300X10949X | Conec | 5000 | - |
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CONN BACKSHELL 25POS 180DEG GRAY |
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ACOV-SUB-09MB38 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 9POS 180DEG SHLD |
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HDC-CTF(4-40)(50) | Hirose Electric Co Ltd | 5000 | - |
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BACKSHELL D-SUB |
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10314-A500-00 | 3M | 5000 | - |
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CONN BACKSHELL 14POS 60DEG SHLD |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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