Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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M2S050-FG896 | Microchip Technology | 5000 | 125.64 |
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IC SOC CORTEX-M3 166MHZ 896FBGA |
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M2S005S-1VFG400T2 | Microchip Technology | 5000 | 0.00 |
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IC SOC CORTEX-M3 166MHZ 400VFBGA |
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BCM58103B0KFBG | Broadcom Limited | 5000 | 7.88 |
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LYNX |
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10AS066H2F34E2LG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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XCVM1802-1MSEVFVC1760 | Xilinx Inc. | 5000 | 8411.97 |
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IC VERSAL AICORE FPGA 1760BGA |
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BCM3380GKFSBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 DATA GATEWAY |
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M2S090-FCS325 | Microchip Technology | 5000 | 127.02 |
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IC SOC CORTEX-M3 166MHZ 325BGA |
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M2S010S-1TQ144 | Microchip Technology | 5000 | 0.00 |
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IC SOC CORTEX-M3 166MHZ 144TQFP |
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BCM5892PD0KFBG | Broadcom Limited | 5000 | 13.80 |
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BCM5892 400MHZ CU WIREBOND |
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10AS066H2F34E2SG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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M2S010TS-VFG400 | Microchip Technology | 5000 | 46.95 |
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IC SOC CORTEX-M3 166MHZ 400VFBGA |
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XCZU17EG-2FFVC1760I | Xilinx Inc. | 5000 | 8527.59 |
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IC SOC CORTEX-A53 1760FCBGA |
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BCM3380MIFSBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 STB FRONT END I-TEMP |
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M2S090-FCSG325 | Microchip Technology | 5000 | 127.02 |
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IC SOC CORTEX-M3 166MHZ 325BGA |
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M2S010S-1TQ144I | Microchip Technology | 5000 | 0.00 |
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IC SOC CORTEX-M3 166MHZ 144TQFP |
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M2S005-1TQG144 | Microchip Technology | 5000 | 16.90 |
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IC SOC CORTEX-M3 166MHZ 144TQFP |
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10AS066H2F34I1SG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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M2S010-1VF400I | Microchip Technology | 5000 | 47.18 |
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IC SOC CORTEX-M3 166MHZ 400VFBGA |
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XCZU17EG-2FFVE1924I | Xilinx Inc. | 5000 | 8527.59 |
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IC SOC CORTEX-A53 1924FCBGA |
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BCM3380MKFEBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 STB FRONT END |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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