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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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M2S005-1TQG144I | Microchip Technology | 5000 | 18.93 |
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IC SOC CORTEX-M3 166MHZ 144TQFP |
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10AS066H3F34E2SG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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M2S010TS-VF256I | Microchip Technology | 5000 | 47.27 |
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IC SOC CORTEX-M3 166MHZ 256FBGA |
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XCVM1802-1MSEVSVD1760 | Xilinx Inc. | 5000 | 8723.16 |
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IC VERSAL AICORE FPGA 1760BGA |
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10AS048K2F35E1SG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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BCM3371IPBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 DATA MODEM |
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M2S060-1VFG400 | Microchip Technology | 5000 | 129.73 |
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IC SOC CORTEX-M3 166MHZ 400VFBGA |
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M2S005-1VF256 | Microchip Technology | 5000 | 19.28 |
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IC SOC CORTEX-M3 166MHZ 256FBGA |
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10AS066H3F34I2LG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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M2S010TS-VFG256I | Microchip Technology | 5000 | 47.27 |
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IC SOC CORTEX-M3 166MHZ 256FBGA |
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XAZU11EG-1FFVF1517Q | Xilinx Inc. | 5000 | 8750.22 |
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IC ZUS MPSOC FPGA 1517FCBGA |
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10AS048K2F35I1SG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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BCM3379IPBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 DATA MODEM |
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M2S060-VF400I | Microchip Technology | 5000 | 129.73 |
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IC SOC CORTEX-M3 166MHZ 400VFBGA |
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M2S005-1VFG256 | Microchip Technology | 5000 | 19.28 |
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IC SOC CORTEX-M3 166MHZ 256FBGA |
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10AS066H4F34E3LG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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A2F200M3F-1CS288I | Microchip Technology | 5000 | 47.66 |
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IC SOC CORTEX-M3 100MHZ 288CSP |
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XCVM1802-1MSEVSVA2197 | Xilinx Inc. | 5000 | 9034.35 |
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IC VERSAL AICORE FPGA 2197BGA |
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10AS066N2F40I1SP | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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BCM3382DIFEBG | Broadcom Limited | 5000 | 0.00 |
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DOCSIS 3.0 DATA MODEM |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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