Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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HIP9011ABT | Renesas Electronics America Inc | 5000 | 0.00 |
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IC SENSOR ENGINE KNOCK 20-SOIC |
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ZSC31050FIB | Renesas | 5000 | 4.02 |
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WAFER (UNSAWN) - BOX |
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XR18910ILMTR-64 | MaxLinear, Inc. | 5000 | 0.00 |
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IC FRONT END W/ MUX 8:1 24QFN |
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PT8A2645WE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER SO-16 |
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AD9973BBCZ | Rochester Electronics, LLC | 5000 | 41.52 |
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IC CCD SGNL PROC 14BIT 84CSBGA |
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ZSC31014EAD | Renesas | 5000 | 4.09 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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XR18910IL-65 | MaxLinear, Inc. | 5000 | 0.00 |
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IC FRONT END W/ MUX 8:1 24QFN |
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PT8A2646PE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER DIP-16 |
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TDE0160FPT | STMicroelectronics | 5000 | 0.00 |
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IC PROXIMITY DETECTORS 14-SOIC |
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ZSC31050FAB | Renesas | 5000 | 4.50 |
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WAFER (UNSAWN) - BOX |
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AK8981AH | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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INTEGRATED CIRCUIT |
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PT8A2646WE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER SO-16 |
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AD9804AJSTZ | Rochester Electronics, LLC | 5000 | 5.16 |
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IC CCD SIGNAL PROC 10BIT 48-LQFP |
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ZSSC3154BA1B | Renesas | 5000 | 4.53 |
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WAFER (UNSAWN) - BOX |
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AK8980 | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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IC INTERFACE SENSOR |
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PT8A2647PE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER DIP-16 |
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AD9804AJSTZRL | Rochester Electronics, LLC | 5000 | 5.01 |
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IC CCD SIGNAL PROC 10BIT 48-LQFP |
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MCZ33793AEFR2 | NXP USA Inc. | 5000 | 5.21 |
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IC DSI SLAVE SENSOR 16-SOIC |
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AK8996 | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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IC INTERFACE PRESS SENSOR 16UQFN |
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PT8A2647WE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER SO-16 |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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