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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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SX8722I070TRLF | Semtech Corporation | 5000 | 0.00 |
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IC ZOOMING ADC 10BIT 16CH 44MLPQ |
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MCZ33793AEF | NXP USA Inc. | 5000 | 5.21 |
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IC DSI SLAVE SENSOR 16-SOIC |
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AK8996W | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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IC INTERFACE PRESS SENSOR WAFER |
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PT8A2648PE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER DIP-16 |
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TCA505BG | Infineon Technologies | 5000 | 0.00 |
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IC SWITCH PROX INDCT PDSO-16 |
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ZSC31015EED | Renesas | 5000 | 5.28 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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AK8998 | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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IC INTERFACE PRESS SENSOR QFN |
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PT8A2648WE | Diodes Incorporated | 5000 | 0.89 |
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PIR CONTROLLER SO-16 |
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MXB7846EUE+ | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC CNTRLR TOUCH RES 16TSSOP |
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ZSSC3123AA1D | Renesas | 5000 | 5.70 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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AK8998D | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
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IC INTERFACE PRESS SENSOR DIE |
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A6850KLTR-T | Allegro MicroSystems | 5000 | 0.92 |
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IC SWITCH INTERFACE 2CHAN 8SOIC |
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MXB7846EEE+ | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC CNTRLR TOUCH RES 16QSOP |
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ZSSC3123AI1D | Renesas | 5000 | 5.70 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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AK8998W | Asahi Kasei Microdevices/AKM | 5000 | 0.00 |
Add To CartInquiry Now |
IC INTERFACE PRESS SENSOR WAFER |
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A5303SLETR-T | Allegro MicroSystems | 5000 | 0.81 |
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IC SMOKE DETECTOR PHOTO 20TSSOP |
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MXB7846EEE+T | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC CNTRLR TOUCH RES 16QSOP |
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ZSC31050FEB | Renesas | 5000 | 6.09 |
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WAFER (UNSAWN) - BOX |
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S-5470D21I-M5T1U | ABLIC Inc. | 5000 | 0.00 |
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IC SIGNAL DETECTION SOT23-5 |
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MTCH112T-I/MF | Microchip Technology | 5000 | 0.92 |
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IC PROXIMITY DETECTOR 8DFN |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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