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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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MCZ33793EF | Rochester Electronics, LLC | 5000 | 2.07 |
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SENSOR INTERFACE, DSI, QUAD, 8 B |
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MAX9924UAUB/V+T | Analog Devices Inc./Maxim Integrated | 5000 | 6.60 |
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IC VR SENSOR INTERFACE 10UMAX |
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ZSSC3230AC3R ES | Renesas Electronics America Inc | 5000 | 0.00 |
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IC CAP SENSOR SIGN COND 24VFQFPN |
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ZSC31014EAB | Renesas | 5000 | 2.09 |
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WAFER (UNSAWN) - BOX |
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MAX9926UAEE/V+T | Analog Devices Inc./Maxim Integrated | 5000 | 6.60 |
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IC VR SENSOR INTERFACE 16QSOP |
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ZSSC3240BI3R-ES | Renesas Electronics America Inc | 5000 | 0.00 |
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IC SENSOR SIGNAL CONDITIONER |
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ZSSC3018BA2B | Renesas | 5000 | 2.18 |
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WAFER (UNSAWN) - BOX |
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MAX9927AEE/V+T | Analog Devices Inc./Maxim Integrated | 5000 | 6.60 |
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IC VR SENSOR INTERFACE 16QSOP |
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ZSSC3240BI1B | Renesas Electronics America Inc | 5000 | 0.00 |
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IC SENSOR SIGNAL CONDITIONER |
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ZSC31015EIB | Renesas | 5000 | 2.39 |
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WAFER (UNSAWN) - BOX |
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PGA308TDD1 | Texas Instruments | 5000 | 6.77 |
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IC PROG SENSOR SGNL COND DIE |
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ZSSC3230AI3R ES | Renesas Electronics America Inc | 5000 | 0.00 |
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IC CAP SENSOR SIGNAL CONDITIONER |
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HIP9011ABZ | Rochester Electronics, LLC | 5000 | 2.40 |
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ENGINE KNOCK SIGNAL PROCESSOR, |
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LTKA01CN8#PBF | Analog Devices Inc. | 5000 | 6.83 |
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IC THERMOCOUPLE AMPLIFIER 8-DIP |
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ZSSC3230AC3V ES | Renesas Electronics America Inc | 5000 | 0.00 |
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IC CAP SENSOR SIGN COND 24VFQFPN |
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ZSC31015EAB | Renesas | 5000 | 2.64 |
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WAFER (UNSAWN) - BOX |
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LTKA00CN8#PBF | Analog Devices Inc. | 5000 | 6.83 |
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IC THERMOCOUPLE AMPLIFIER 8-DIP |
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U2780-XS1401D1 | Renesas Electronics America Inc | 5000 | 0.00 |
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IC MODULE SENSOR |
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ZSSC3135BA1B | Renesas | 5000 | 2.76 |
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WAFER (UNSAWN) - BOX |
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ADPD144RI-ACEZ-RL | Analog Devices Inc. | 5000 | 6.90 |
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OPTICAL BIOMETRIC TRANS RED & IN |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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