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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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RE46C166S16F | Microchip Technology | 5000 | 0.99 |
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IC SMOKE DETECT PHOTO MEM 16SOIC |
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ZSSC3122AI1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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ZSC31014EID | Renesas | 5000 | 3.45 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C167E16F | Microchip Technology | 5000 | 1.01 |
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IC SMOKE DETECT PHOTO MEM 16DIP |
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ZSSC3123AA1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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ZSC31150GAB | Renesas | 5000 | 3.53 |
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WAFER (UNSAWN) - BOX |
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RE46C163E16F | Microchip Technology | 5000 | 1.01 |
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IC SMOKE DETECT ION CMOS 16DIP |
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ZSSC3123AI1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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ZSC31150GEB | Renesas | 5000 | 3.53 |
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WAFER (UNSAWN) - BOX |
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RE46C165E16F | Microchip Technology | 5000 | 1.01 |
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IC SMOKE DETECT PHOTOELEC 16DIP |
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ZSSC3131BA1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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ZSC31010CED | Renesas | 5000 | 3.60 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C168E16F | Microchip Technology | 5000 | 1.01 |
Add To CartInquiry Now |
IC SMOKE DETECT PHOTO MEM 16DIP |
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ZSSC3131BA1C | Renesas | 5000 | 0.00 |
Add To CartInquiry Now |
DICE (WAFER SAWN) - FRAME |
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RE46C162E16F | Microchip Technology | 5000 | 1.01 |
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IC SMOKE DETECT ION CMOS 16DIP |
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ZSSC3131BA1D | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C144SW16F | Microchip Technology | 5000 | 1.02 |
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IC SMOKE DETECTOR CMOS 16-SOIC |
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ZSSC3131BE1B | Renesas | 5000 | 0.00 |
Add To CartInquiry Now |
WAFER (UNSAWN) - BOX |
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RE46C144SW16TF | Microchip Technology | 5000 | 1.02 |
Add To CartInquiry Now |
IC SMOKE DETECTOR CMOS 16-SOIC |
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ZSSC3131BE1C | Renesas | 5000 | 0.00 |
Add To CartInquiry Now |
DICE (WAFER SAWN) - FRAME |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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