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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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VSC8582XKS-14 | Microchip Technology | 5000 | 50.40 |
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IC TELECOM INTERFACE 256BGA |
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BCM57760A1KMLG | Broadcom Limited | 5000 | 0.00 |
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INTEGRATED GIGABIT-ETHERNET CO |
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PEF 24901 H V2.2 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-64 |
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MT8888CSR1 | Microchip Technology | 5000 | 4.34 |
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IC TELECOM INTERFACE 20SOIC |
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HC55150CB | Rochester Electronics, LLC | 5000 | 4.00 |
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SLIC |
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BCM68385CIFSBG | Broadcom Limited | 5000 | 8.76 |
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EPON/GPON GE PROCESSOR |
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HDMP-0422 | Rochester Electronics, LLC | 5000 | 5.34 |
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TELECOM CIRCUIT, BIPOLAR, PDSO24 |
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BCM63138SUKFSBG | Broadcom Limited | 5000 | 51.75 |
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HIGH PERFORMANCE VDSL GATEWAY/RO |
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BCM5784MKMLG | Broadcom Limited | 5000 | 0.00 |
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INTEGRATED GBE MOBILE MAC/PHY |
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PEF 24902 H V2.1 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-64 |
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SI32170-C-GM1R | Skyworks Solutions Inc. | 5000 | 4.37 |
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IC TELECOM INTERFACE 42QFN |
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PBL387821QSD | Rochester Electronics, LLC | 5000 | 4.01 |
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FLEXISLIC SLIC |
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LE79252BTC | Microchip Technology | 5000 | 8.82 |
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IC TELECOM INTERFACE 44TQFP |
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PSB4451RV1.2 | Rochester Electronics, LLC | 5000 | 5.36 |
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ANIC ANALOG NETWORK INTERFACE CI |
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BCM68580XFB1IFSBG | Broadcom Limited | 5000 | 51.75 |
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10G XPON HGU WITH 2XHSGMII |
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BCM5787MKFBG | Broadcom Limited | 5000 | 0.00 |
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INTEGRATED GBE MOBILE MAC/PHY |
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PEF 24911 H V2.2 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-64 |
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SI3011-F-FSR | Skyworks Solutions Inc. | 5000 | 4.37 |
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IC TELECOM INTERFACE 16SOIC |
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UCC5343M | Rochester Electronics, LLC | 5000 | 4.11 |
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TELECOM CIRCUIT, 1-FUNC, BICMOS |
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LE79252BTCT | Microchip Technology | 5000 | 8.91 |
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IC TELECOM INTERFACE 44TQFP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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