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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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BCM68460UA1KRFBG | Broadcom Limited | 5000 | 9.37 |
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EPON/GPON HGU WITH NEW SUBSTRATE |
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PEF 3314 EL V2.1-G | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE 144LBGA |
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PEF33008HLV2.1 | Rochester Electronics, LLC | 5000 | 5.98 |
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VINETIC VOICE ACCESS SOLUTION |
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82P5088BBG | Renesas Electronics America Inc | 5000 | 54.78 |
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IC TELECOM INTERFACE 256BGA |
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BCM63138ZSQ01 | Broadcom Limited | 5000 | 0.00 |
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63138Z+6303+4360X2 |
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LE58QL063HVC | Microchip Technology | 5000 | 4.47 |
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IC TELECOM INTERFACE 64LQFP |
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SI32261-C-FM2R | Skyworks Solutions Inc. | 5000 | 7.85 |
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IC TELECOM INTERFACE 60QFN |
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MPL360B-I/SCB | Microchip Technology | 5000 | 9.44 |
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IC TELECOM INTERFACE 48QFN |
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PEF 3314 EL V2.2-G | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE 144LBGA |
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HC55185GCM | Rochester Electronics, LLC | 5000 | 5.98 |
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SLIC, BIPOLAR, PQCC28 |
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82P5088BBG8 | Renesas Electronics America Inc | 5000 | 54.78 |
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IC TELECOM INTERFACE 256BGA |
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SI3210-FTR | Skyworks Solutions Inc. | 5000 | 4.50 |
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IC TELECOM INTERFACE 38TSSOP |
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SN75FC1000BPJD | Rochester Electronics, LLC | 5000 | 4.32 |
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TELECOM CIRCUIT, GAAS, PQFP64 |
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MPL360B-I/Y8X | Microchip Technology | 5000 | 9.44 |
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IC TELECOM INTERFACE 48TQFP |
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PEF 3314 HL V2.2 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE 176-LQFP |
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HDMP-0422G | Rochester Electronics, LLC | 5000 | 6.00 |
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TELECOM CIRCUIT, BIPOLAR, PDSO24 |
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BCM63168ESG01 | Broadcom Limited | 5000 | 0.00 |
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63168E+6302+53124S |
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VSC7440XMT | Microchip Technology | 5000 | 54.90 |
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IC TELECOM INTERFACE 324BGA |
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CPC7695ZC | IXYS Integrated Circuits Division | 5000 | 4.51 |
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IC TELECOM INTERFACE 20SOIC |
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LE79112AKVC | Microchip Technology | 5000 | 9.54 |
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IC TELECOM INTERFACE 128TQFP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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