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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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0760105124 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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2149151-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN DUST CAP FOR CFP RCPT |
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FX16-31P-GNDL | Hirose Electric Co Ltd | 5000 | - |
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CONN GND PLATE FOR FX16 SERIES |
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0760105125 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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0747200501 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR SFP CONN |
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FX15S-41P-GND | Hirose Electric Co Ltd | 5000 | - |
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CONN GND PLATE FOR FX15 SERIES |
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0760105126 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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0747630020 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR QSFP CONN |
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FX15S-51P-GND(A) | Hirose Electric Co Ltd | 5000 | - |
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CONN GND PLATE FOR FX15 SERIES |
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0760105127 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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2288218-6 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEAT SINK FOR CFP2 CAGES |
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0506398028 | Molex | 5000 | - |
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CONN CONTACT FOR SERIAL I/O CONN |
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0760105130 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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2169666-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HARDWARE KIT FOR CFP CONN |
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GT17HN-4DS-R(6) | Hirose Electric Co Ltd | 5000 | - |
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CONN INLINE SOCKET RETAINER |
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0760105131 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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0747650904 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR SFP+ CONN |
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GT17HSK-4S-HU(20) | Hirose Electric Co Ltd | 5000 | - |
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CONN INLINE SOCKET HOUSING |
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0760105132 | Molex | 5000 | - |
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CONN SHELL FOR IPASS SERIES |
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0476341002 | Molex | 5000 | - |
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CONN CONTACT FOR SATA HSG |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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