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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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2007309-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN LIGHT PIPE FOR QSFP+ CAGE |
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GT17HS2-4S-HU | Hirose Electric Co Ltd | 5000 | - |
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CONN HSG FOR GT17 SERIES |
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2132187-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN GASKET FOR QSFP+ CAGE |
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GT17HSK-4S-HU(6.15) | Hirose Electric Co Ltd | 5000 | - |
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CONN HSG FOR GT17 SERIES |
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2324698-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN DUST CAP FOR OSFP |
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U90-1101-7000-BP | Amphenol CS (Commercial Products) | 5000 | - |
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QSFP CAGE ASSEMBLY |
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0589341028 | Molex | 5000 | - |
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2.0 I/O PLG SHELL BODY W/PLT 10C |
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0747270002 | Molex | 5000 | - |
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CONN LIGHT PIPE FOR SFP CAGE |
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1-1324504-0 | TE Connectivity AMP Connectors | 5000 | - |
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CONN OUTR FERRULE FOR HSSDC2 PLG |
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0598320009 | Molex | 5000 | - |
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M2 CROSS RECESSED SCREW |
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2132188-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN GASKET FOR QSFP+ CAGE |
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GT17HNHF-4DS-2C(A) | Hirose Electric Co Ltd | 5000 | - |
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CONN FEMALE INSULATOR |
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0539900605 | Molex | 5000 | - |
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2.0 I/O MOLD COVER B |
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2173234-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEATSNK CLP FOR ZQSFP+ HSNK |
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GT17HNF-4DS-2C(B) | Hirose Electric Co Ltd | 5000 | - |
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CONN INSULATOR FOR GT17 SERIES |
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0541820605 | Molex | 5000 | - |
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2.0 I/O PLG MOLD COVER B 6CKT GR |
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2317857-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN DUST CAP FOR OSFP |
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GT17HN2-4DS-HU(6) | Hirose Electric Co Ltd | 5000 | - |
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CONN INLINE SOCKET HOUSING |
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0539890605 | Molex | 5000 | - |
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2.0 I/O MOLD COVER A |
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2180467-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SCREW FOR CFP CONN |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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