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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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GT17-8DS-SC(70) | Hirose Electric Co Ltd | 5000 | - |
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CONN SHD PLATE FOR GT17 INSULATR |
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0747630010 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR QSFP CONN |
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GT17HNFS-4DS-5CF | Hirose Electric Co Ltd | 5000 | - |
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CONN PCB 4POS |
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0768668806 | Molex | 5000 | - |
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CONN DUST CAP FOR IPASS SERIES |
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2227326-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEATSINK/HARDWR KIT FOR CFP |
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GT17V-6DS-SC | Hirose Electric Co Ltd | 5000 | - |
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CONN SHD PLATE FOR GT17 INSULTR |
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0580990628 | Molex | 5000 | - |
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CONN SHELL FOR SERIAL I/O CONN |
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2300837-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEATSINK/HARDWR KIT FOR CFP |
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GT17V-10DP-2C | Hirose Electric Co Ltd | 5000 | - |
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CONN INSULATOR FOR GT17 SERIES |
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0747830363 | Molex | 5000 | - |
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CONN CLIPS FOR QSFP+ HEAT SINKS |
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54185-2201 | WEC | 5000 | - |
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2.0 I/O MOLD LOWER COVER 22CKT |
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GT17VS-10DP-5.2CF | Hirose Electric Co Ltd | 5000 | - |
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CONN SHD PLATE FOR GT17 INSULATR |
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0747500031 | Molex | 5000 | - |
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CONN LIGHT PIPE FOR QSFP+ CAGE |
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76010-5031 | WEC | 5000 | - |
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IPASS R/A SHELL SMT UNIV KEY 26 |
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1-1888864-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SHELL FOR MINISAS RCPT |
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2170249-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN EMI GASKET FOR QSFP+ CAGE |
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76010-5032 | WEC | 5000 | - |
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IPASS R/A SHELL T/H UNIV KEY 26 |
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1-1888864-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SHELL FOR MINISAS RCPT |
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0541810815 | Molex | 5000 | - |
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2.0 I/O MOLD COVER A ASSY 8CKT G |
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74727-0001 | WEC | 5000 | - |
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1X2 SFP LT PIPE CVR ASY BACK TO |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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