Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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MIC38C42BM-TR | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SWITCH MULT TOP 8SOIC |
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FSD176MRBTLDTU | onsemi | 5000 | 0.00 |
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IC OFFLINE SWITCH |
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NCP1399AGDR2G | onsemi | 5000 | 0.73 |
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IC OFFLINE SW HALF-BRDG 16SOIC |
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AP3968MTR-G1 | Diodes Incorporated | 5000 | 0.00 |
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IC PSR SWITCHER ACDC 7-SO |
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ICE3A3065PBKSA1 | Rochester Electronics, LLC | 5000 | 1.19 |
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IC OFFLINE SW FLYBACK TO220-6 |
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TOP243F | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO262-7C |
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MIC38C42BN | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SWITCH MULT TOP 8DIP |
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FSFR1800XC | onsemi | 5000 | 0.00 |
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IC OFFLINE SWITCH |
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NCP1399AHDR2G | Flip Electronics | 5000 | 1.34 |
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IC OFFLINE SW HALF-BRDG 16SOIC |
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TOP233YNAU | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO220-7 |
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ICE3A3565I | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK TO220 |
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TOP243G | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
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MIC38C44-1BM | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW MULT TOP 14SOIC |
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FSL126MRG | onsemi | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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NCP1399BADR2G | onsemi | 5000 | 1.34 |
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IC OFFLINE SW HALF-BRDG 16SOIC |
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TEA1506AP/N1,112 | NXP USA Inc. | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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ICE3A3565PBKSA1 | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO220-6 |
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TOP243G-TL | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
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MIC38C44-1BM-TR | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW MULT TOP 14SOIC |
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FSL136MRG | onsemi | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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