Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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ICE3AR4780JZXKLA1 | Infineon Technologies | 5000 | 1.36 |
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IC OFFLINE SWITCH FLYBACK 7DIP |
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TEA1655T/N1,518 | NXP USA Inc. | 5000 | 0.00 |
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IC OFFLINE SWITCH 16SO |
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ICE3B0565 | Rochester Electronics, LLC | 5000 | 1.15 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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TOP245Y | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO220-7C |
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MIC38HC42-1BM | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW MULT TOP 14SOIC |
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STR-X6428A | Sanken | 5000 | 0.00 |
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IC OFFLINE SWITCH TO3PF |
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INN3267C-H205-TL | Power Integrations | 5000 | 1.36 |
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IC OFFLINE SW MULT TOP 24INSOP |
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TEA1656T/N1,118 | NXP USA Inc. | 5000 | 0.00 |
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IC OFFLINE SWITCH 8SOIC |
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ICE3B1065FKLA1 | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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TOP246F | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO262-7C |
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MIC38HC42-1BM-TR | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW MULT TOP 14SOIC |
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STR-X6429A | Sanken | 5000 | 0.00 |
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IC OFFLINE SWITCH TO3PF |
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HR1001CGS-Z | Monolithic Power Systems Inc. | 5000 | 1.37 |
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IC OFFLINE SWITCH 16SOIC |
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TEA1657T/N1,518 | NXP USA Inc. | 5000 | 0.00 |
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IC OFFLINE SWITCH 16SO |
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TOP246GN | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
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MIC38HC42-1BN | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SWITCH MULT TOP 14DIP |
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STR-X6456 | Sanken | 5000 | 0.00 |
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IC OFFLINE SWITCH TO3PF |
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HF920GSE-Z | Monolithic Power Systems Inc. | 5000 | 1.37 |
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IC OFFLINE SWITCH FLYBACK 8SOIC |
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ICE3B1565FKLA1 | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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TEA1530AT/N2/DG,11 | NXP USA Inc. | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SO |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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