Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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3RT1956-4EA2 | Siemens Industry, Inc. | 5000 | - |
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CONTACTOR FINGERSAFE COVERS 3RT1 |
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U3/32 0.6 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MAN-AUTO .4-.6A |
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J73KC-AM-04 | Omron Automation and Safety | 5000 | - |
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AUXILIARY CONTACT UNIT,4PST-4NC |
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AQP812 | Panasonic Electric Works | 5000 | - |
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HEAT SINK SLIM 45MM |
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U3/32 4 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MAN-AUTO 2.7-4A |
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J73KC-AM-40 | Omron Automation and Safety | 5000 | - |
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AUXILIARY CONTACT UNIT,4PST-4NO |
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AQP-HS-J25A | Panasonic Electric Works | 5000 | - |
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HEAT SINK |
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U3/32 6 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MAN-AUTO 4-6A |
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MTMZ0W00 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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RELAY SOCKET FUNCTION MODULE |
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WF114200 | Celduc | 5000 | - |
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HEATSINK DIN 1,75C/W FOR SA/SO/S |
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U3/32 1.8 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MAN-AUTO 1.2-1.8A |
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65008-D04 | TE Connectivity Deutsch Connectors | 5000 | - |
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RAIL ASSY |
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RHS10067D | Carlo Gavazzi Inc. | 5000 | - |
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HEATSINK SSR 121X76X67MM |
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U3/32 1.2 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MAN-AUTO 0.8-1.2A |
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MTMF0W00 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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RELAY SOCKET FUNCTION MODULE |
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GCA63A208VAC60HZ | Carlo Gavazzi Inc. | 5000 | - |
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COIL ASSY 35-63A 208VAC 60HZ |
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LG5830-2 | B&J-USA, Inc. | 5000 | - |
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250MM WIRE USE WITH U3/42G |
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J7TC-01-2E6 | Omron Automation and Safety | 5000 | - |
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THERMAL OVERLOAD RELAY,24-600 VA |
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GCA63A240VAC60HZ | Carlo Gavazzi Inc. | 5000 | - |
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COIL ASSY 35-63A 240VAC 60HZ |
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U12/16E 11 K3 | B&J-USA, Inc. | 5000 | - |
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K3 OVERLOAD MANUAL 8-11A |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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