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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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SL3S1213FUF,003 | NXP USA Inc. | 5000 | - |
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IC UCODE G2XL UNCASED FOIL |
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SL3S1213FUD/BG,003 | NXP USA Inc. | 5000 | - |
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IC U-CODE G2IL+ DIE WAFER |
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NT2L1011G0DUDV | NXP USA Inc. | 5000 | - |
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IC SMART TAG NFC TYPE2 UNCASED |
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NT2L1011G0DUFV | NXP USA Inc. | 5000 | - |
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IC SMART TAG NFC TYPE2 UNCASED |
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AS3955A-ATWT | ams | 5000 | - |
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IC NFC INTERFACE 12WLCSP |
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HTCICC6403FUG/AM,0 | NXP USA Inc. | 5000 | - |
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TRANSPONDER RFIC HITAG RO64 DIE |
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SL2S1402FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT UNCASED WAFER |
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SL2S1502FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT UNCASED WAFER |
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MF0UL1101DUD,005 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT EV1 UNCASED |
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MF0UL1101DUF,005 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT EV1 UNCASED |
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SL3S1214FUF/AFZ | NXP USA Inc. | 5000 | - |
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IC RFID CHIP UCODE 7 UNCASED |
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HTCICC6402FUG/AM,0 | NXP USA Inc. | 5000 | - |
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TRANSPONDER RFIC HITAG RO64 DIE |
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SL2S1412FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT-M UNCASED WAFER |
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SL2S1512FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT-M UNCASED WAFER |
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SL2S1602FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT UNCASED WAFER |
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NT2L1211G0DUDV | NXP USA Inc. | 5000 | - |
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IC SMART TAG NFC TYPE2 UNCASED |
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SL3S1214FUF/AFV | NXP USA Inc. | 5000 | - |
Add To CartInquiry Now |
IC RFID CHIP UCODE 7 UNCASED |
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NT2L1211G0DUFV | NXP USA Inc. | 5000 | - |
Add To CartInquiry Now |
IC SMART TAG NFC TYPE2 UNCASED |
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MF0UL2101DUD,005 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT EV1 UNCASED |
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MF0UL2101DUF,005 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT EV1 UNCASED |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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