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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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SL2S1612FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE ILT-M UNCASED WAFER |
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HTMS8001FUG/AM,005 | NXP USA Inc. | 5000 | - |
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IC TRANSPONDER RFID HITAG |
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SL3S1204FUD/BG/MVZ | NXP USA Inc. | 5000 | - |
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IC RFID CHIP UCODE 7 UNCASED |
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SL2S5002FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI UNCASED FOIL |
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NT2H1311G0DUDZ | NXP USA Inc. | 5000 | - |
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IC NFC TAG TYPE 2 144BYTE IC |
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SL2S2002FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI UNCASED FOIL |
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SL2S2202FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI UNCASED FOIL |
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SL3S1214FTB0X | NXP USA Inc. | 5000 | - |
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IC UCODE G2XL XSON6 |
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HTMS8101FUG/AM,005 | NXP USA Inc. | 5000 | - |
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IC TRANSPONDER RFID HITAG |
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SL2S5102FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI UNCASED FOIL |
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SL2S2102FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI SOT1122 |
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HTSICH5601EW/V7:00 | NXP USA Inc. | 5000 | - |
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TRANSPONDER RFIC HITAG S UNCASED |
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SL3S1204FTB0X | NXP USA Inc. | 5000 | - |
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IC UCODE G2XL XSON6 |
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NT2H1511G0DUDZ | NXP USA Inc. | 5000 | - |
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IC NFC TAG TYPE 2 504BYTE IC |
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HTSICC5601EW/C7,00 | NXP USA Inc. | 5000 | - |
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TRANSPONDER RFIC HITAG S UNCASED |
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SL3S1203FTB0,115 | NXP USA Inc. | 5000 | - |
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IC UCODE G2XL SOT886 |
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SL3S1202FTB1,115 | NXP USA Inc. | 5000 | - |
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IC UCODE G2XL FTB1 3XSON |
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SL3S5002N0FUD/00BZ | NXP USA Inc. | 5000 | - |
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IC U-CODE 00BG UNCASED |
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HTMS1001FUG/AM,005 | NXP USA Inc. | 5000 | - |
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IC TRANSPONDER HITAG |
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HTSICC5601EW/C7,02 | NXP USA Inc. | 5000 | - |
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TRANSPONDER RFIC HITAG S UNCASED |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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