Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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386826 | Multicore | 5000 | - |
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63/37 400 1% .020DIA 22AWG |
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HV018S | HOMEVISION TECHNOLOGY INC | 5000 | - |
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HVTOOLS PUMP FOR CLEAN SOLDER |
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CC60L2062P | Canfield Technologies | 5000 | - |
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60SN/40PB NO CLEAN 8 OZ .062 DIA |
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386857 | Multicore | 5000 | - |
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63/37 400 3% .032DIA 20AWG |
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HV018B | HOMEVISION TECHNOLOGY INC | 5000 | - |
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HVTOOLS PUMP FOR CLEAN SOLDER |
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RC63L2062E | Canfield Technologies | 5000 | - |
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63SN/37PB ROSIN FLUX 8 OZ .062 D |
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397982 | Multicore | 5000 | - |
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63/37 CRYSL 502 3% .015DIA 27AWG |
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HV0006 | HOMEVISION TECHNOLOGY INC | 5000 | - |
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HVTOOLS ALL PURPOSE SOLDER |
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CC63L2062E | Canfield Technologies | 5000 | - |
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63SN/37PB NO CLEAN FLUX 8 OZ .06 |
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MM01075 | Multicore | 5000 | - |
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63/37 HYDRO-X 2% .024DIA 22AWG |
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WBCANFIELD6040 | SRA Soldering Products | 5000 | - |
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Canfield 60/40 Solder 1 Lb Roll |
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WC63L2062 | Canfield Technologies | 5000 | - |
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63SN/37PB WATER SOLUBLE FLUX 8 O |
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SMD2SWLF.020 .4OZ | Chip Quik Inc. | 5000 | - |
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LF SOLDER WIRE POCKET PACK 99.3/ |
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981501 | Multicore | 5000 | - |
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SAC305 BAR SOLDR 2.5LB +/- 0.2LB |
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WCBLF22701031 | Canfield Technologies | 5000 | - |
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BLF 227 WATER SOLUBLE FLUX 1 LB |
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CC60L2031 | Canfield Technologies | 5000 | - |
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60SN/40PB NO CLEAN FLUX 8 OZ .03 |
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RASWLF.020 .4OZ | Chip Quik Inc. | 5000 | - |
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LF SOLDER WIRE POCKET PACK 96.5/ |
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CCBLF22701031P | Canfield Technologies | 5000 | - |
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BLF 227 NO CLEAN FLUX 1 LB. 031D |
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680290 | Multicore | 5000 | - |
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99C BAR SOLDER 2LB +/- 0.2LB |
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WC60L2031 | Canfield Technologies | 5000 | - |
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60SN/40PB WATER SOLUBLE FLUX 8 O |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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