Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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SMDSWLF.015 .3OZ | Chip Quik Inc. | 5000 | - |
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LF SOLDER WIRE POCKET PACK 96.5/ |
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WC9601062PSAC | Canfield Technologies | 5000 | - |
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SAC 305 WATER SOLUBLE FLUX 1 LB. |
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4877-227G | MG Chemicals | 5000 | - |
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SOLDER 60/40 NOCLEAN .05DIA .5LB |
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RCBLF227L2062E | Canfield Technologies | 5000 | - |
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BLF227 ROSIN FLUX 8 OZ .062 DIA. |
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SMD3SW.031 1OZ | Chip Quik Inc. | 5000 | - |
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SOLDER WIRE 62/36/2 TIN/LEAD/SIL |
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RC9601062PSAC | Canfield Technologies | 5000 | - |
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SAC 305 ROSIN FLUX 1 LB. 062 DIA |
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1042100 | Multicore | 5000 | - |
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60/40C511 3C 1.63MM AF 2.5KG AM |
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WCBLF227L2062E | Canfield Technologies | 5000 | - |
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BLF227 WATER SOLUBLE FLUX 8 OZ . |
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SMD3SW.020 1OZ | Chip Quik Inc. | 5000 | - |
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SOLDER WIRE 62/36/2 TIN/LEAD/SIL |
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CC9601031PAG3 | Canfield Technologies | 5000 | - |
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SAC 305 NO CLEAN 1 LB. .031 DIA |
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386874 | Multicore | 5000 | - |
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96S C400 3C 0.38MM 0.25KG AM |
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RCBLF227L2031E | Canfield Technologies | 5000 | - |
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BLF 227 ROSIN FLUX 8 OZ .031 DIA |
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SMDAG100-S-0.25 | Chip Quik Inc. | 5000 | - |
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SOLDER SHOT AG100 0.25OZ 7G |
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WC9601031P | Canfield Technologies | 5000 | - |
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SAC 305 WATER SOLUBLE FLUX 1 LB. |
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437756 | Multicore | 5000 | - |
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SAV1 366 5C 0.81MM 0.5KG AM |
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WCBLF227L2031 | Canfield Technologies | 5000 | - |
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BLF 227 WATER SOLUBLE FLUX 8 OZ |
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SMD2170-25000 | Chip Quik Inc. | 5000 | - |
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SOLDER SPHERES SN63/PB37 .014" ( |
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RC9601020CQPJ | Canfield Technologies | 5000 | - |
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SAC 305 ROSIN FLUX 1 LB .020 DIA |
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568759 | Multicore | 5000 | - |
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SAV1 366 5C 1.22MM 0.5KG AM |
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CCBLF227L2031P | Canfield Technologies | 5000 | - |
Add To CartInquiry Now |
BLF 227 NO CLEAN FLUX 8 OZ .031 |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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