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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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983-3R-C 20 | TE Connectivity Deutsch Connectors | 5000 | - |
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983-3R-C 20 |
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JR16WCCA-12 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 16 BLACK |
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1604334 | Phoenix Contact | 5000 | - |
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CONN CABLE GLAND SET SILVER |
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MS2504340DDC | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
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FGG.3K.876.TN | LEMO | 5000 | - |
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CONN ADAPTER CABLE SILVER |
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FGG.3B.777.DN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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040-0171-000 | ITT Cannon, LLC | 5000 | - |
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CONN POTTING BOOT 14 15 |
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5204-0012-90 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED FLOUROSILICONE FLANG |
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FGG.5B.713.DN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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JR21WCCA-6 | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 21 BLACK |
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5204-0026-15 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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1520-10-340812-CS2359 | TE Connectivity AMP Connectors | 5000 | - |
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KIT BOOT ADAPTER |
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FGG.4B.130.UB | LEMO | 5000 | - |
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CONN BACK-NUT COLLET |
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MS25043-8DA | Souriau-Sunbank by Eaton | 5000 | - |
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5015 D/C RECP SZ 8 ANOD |
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980-8559-002 | ITT Cannon, LLC | 5000 | - |
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CONN SEALING RING 32 BLUE |
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5204-0013-10 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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FGG.5B.715.DN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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JR21WCCA-8 | Hirose Electric Co Ltd | 5000 | - |
Add To CartInquiry Now |
CONN STRAIN RELIEF 21 BLACK |
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MS27501Z15C | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 15 PLUG MIL |
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PVS81-24CA | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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