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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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RE46C145SW16TF | Microchip Technology | 5000 | 1.23 |
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IC SMOKE DETECTOR CMOS 16-SOIC |
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ZSSC3170EE1D | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C145E16F | Microchip Technology | 5000 | 1.25 |
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IC SMOKE DETECTOR CMOS 16DIP |
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ZSSC3170FE1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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RE46C107E16F | Microchip Technology | 5000 | 1.26 |
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IC HORN DRIVER DUAL 16DIP |
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ZSSC3170FE1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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RE46C317E8F | Microchip Technology | 5000 | 1.28 |
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IC DRIVER HORN PIEZO W/BO 8DIP |
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ZSSC3218BI1B ES | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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TPL9202PWPG4 | Rochester Electronics, LLC | 5000 | 0.92 |
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IC RELAY DRIVER 8CHAN 20HTSSOP |
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ZSSC3218BI1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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RE46C180E16F | Microchip Technology | 5000 | 1.35 |
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IC ION SMOKE DETECT ASIC 16DIP |
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ZSSC3218BI1D ES | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C117E8F | Microchip Technology | 5000 | 1.40 |
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IC HORN DRIVER DUAL 8DIP |
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ZSSC3224BI1B ES | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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APDS-9702-020 | Broadcom Limited | 5000 | 1.40 |
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IC PROXIMITY SENS SGNL COND 8QFN |
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ZSSC3224BI1D ES | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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ZSSC3230BI1B | Renesas Electronics America Inc | 5000 | 1.45 |
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IC CAP SENSOR SIGN CONDITIONER |
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ZSSC4151AE1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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XTR117AIDGKRG4 | Texas Instruments | 5000 | 1.46 |
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IC CURRENT TRANSMITTER 8VSSOP |
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ZSSC4151AE1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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