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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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RE46C194S16 | Microchip Technology | 5000 | 1.07 |
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3V E-CAL PHOTO S.D. IC |
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ZSSC3138BE1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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RE46C194S16T | Microchip Technology | 5000 | 1.07 |
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3V E-CAL PHOTO S.D. IC |
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ZSSC3154BA1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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RE46C105S14F | Microchip Technology | 5000 | 1.11 |
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IC HORN DRIVER DUAL 14SOIC |
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ZSSC3154BE1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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RE46C107S16TF | Microchip Technology | 5000 | 1.11 |
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IC HORN DRIVER DUAL 16SOIC |
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ZSSC3154BE1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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MAX9921AUB+T | Analog Devices Inc./Maxim Integrated | 5000 | 1.16 |
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IC SENSOR HALL EFFECT 10-MSOP |
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ZSSC3154BE1D | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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RE46C180S16TF | Microchip Technology | 5000 | 1.16 |
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IC ION SMOKE DETECT ASIC 16SOIC |
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ZSSC3170EA1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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RE46C104E14F | Microchip Technology | 5000 | 1.17 |
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IC HORN DRIVER DUAL 14DIP |
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ZSSC3170EA1C | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - FRAME |
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RE46C105E14F | Microchip Technology | 5000 | 1.17 |
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IC HORN DRIVER DUAL 14DIP |
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ZSSC3170EA1D | Renesas | 5000 | 0.00 |
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DICE (WAFER SAWN) - WAFFLE PACK |
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XTR111AIDGQRG4 | Texas Instruments | 5000 | 1.19 |
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IC PREC VOLT-CURR CONV/TX 10MSOP |
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ZSSC3170EE1B | Renesas | 5000 | 0.00 |
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WAFER (UNSAWN) - BOX |
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RE46C145SW16F | Microchip Technology | 5000 | 1.23 |
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IC SMOKE DETECTOR CMOS 16-SOIC |
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ZSSC3170EE1C | Renesas | 5000 | 0.00 |
Add To CartInquiry Now |
DICE (WAFER SAWN) - FRAME |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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