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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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BCM63168VSAB02 | Broadcom Limited | 5000 | 0.00 |
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63168V+6303 |
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VSC7414XMT-01 | Microchip Technology | 5000 | 70.38 |
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11 PORT MANAGED SGMII ENTERPRISE |
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SI32282-A-FM | Skyworks Solutions Inc. | 5000 | 4.98 |
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IC TELECOM INTERFACE 56QFN |
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LE89810BSCT | Microchip Technology | 5000 | 1.28 |
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IC TELECOM INTERFACE 16SOIC |
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MT9122APR1 | Microchip Technology | 5000 | 12.60 |
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IC TELECOM INTERFACE 28PLCC |
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PSB 21483 F V1.7 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE TQFP-144 |
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PEF4365TV2.1 | Rochester Electronics, LLC | 5000 | 7.33 |
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DUSLIC: TWIN SUBSCRIBER LINE INT |
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BCM63168VSAD01 | Broadcom Limited | 5000 | 0.00 |
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63168V+6303+6306+4360 FOR VDSL |
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VSC7427XJG-02 | Microchip Technology | 5000 | 72.53 |
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IC TELECOM INTERFACE 672BGA |
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LE79R70DJC | Microchip Technology | 5000 | 5.00 |
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IC TELECOM INTERFACE 32PLCC |
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LE87612MQC | Microchip Technology | 5000 | 1.29 |
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IC TELECOM INTERFACE 28QFN |
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BCM63177A2VKFEBG | Broadcom Limited | 5000 | 12.66 |
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VDSL 17A + 11AC/11N WIFI, AND VO |
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PSB 21493 F V1.7 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE TQFP-144 |
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HC3-5504DLC-5 | Rochester Electronics, LLC | 5000 | 7.35 |
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EIA/ITU PABX SLIC |
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BCM63168VSAH01 | Broadcom Limited | 5000 | 0.00 |
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63168V+6303+53124S+4360 |
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VSC8488YJU | Microchip Technology | 5000 | 73.32 |
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IC TELECOM INTERFACE 196FCBGA |
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LE57D111BTCT | Microchip Technology | 5000 | 5.00 |
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IC TELECOM INTERFACE 44TQFP |
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BCM68901IMLG | Broadcom Limited | 5000 | 1.29 |
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XPON PMD DEVICE |
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PSB 21493 H V1.7 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-144 |
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BCM63167VKREBG | Broadcom Limited | 5000 | 12.68 |
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FEATURE/COST REDUCTION VERION OF |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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