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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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82V2108PXG | WEC | 5000 | 85.02 |
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IC TELECOM INTERFACE 128QFP |
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SI32287-A-GMR | Skyworks Solutions Inc. | 5000 | 4.89 |
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IC TELECOM INTERFACE 56QFN |
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LE9541CUQCT | Microchip Technology | 5000 | 1.25 |
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IC TELECOM INTERFACE 40QFN |
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MT9122AP1 | Microchip Technology | 5000 | 12.23 |
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IC TELECOM INTERFACE 28PLCC |
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PSB 21391 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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ISL5585GCM | Rochester Electronics, LLC | 5000 | 7.17 |
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SLIC, 2-4 CONVERSION, BIPOLAR |
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BCM63168UST01 | Broadcom Limited | 5000 | 0.00 |
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63168UD1 BONDING CHIPSET |
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82V2108PXG8 | Renesas Electronics America Inc | 5000 | 67.12 |
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IC TELECOM INTERFACE 128QFP |
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LE57D111BTC | Microchip Technology | 5000 | 4.91 |
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IC TELECOM INTERFACE 44TQFP |
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LE9551DMQC | Microchip Technology | 5000 | 1.25 |
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IC TELECOM INTERFACE 28QFN |
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BCM68369B1KFEBG | Broadcom Limited | 5000 | 12.35 |
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ETHERNET HGW/AP |
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PSB 21393 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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SAF82526HV2.1-HSCX-1 | Rochester Electronics, LLC | 5000 | 7.17 |
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SERIAL COMMUNICATION CONTROLLER |
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BCM63168USU01 | Broadcom Limited | 5000 | 0.00 |
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63168UD1 BONDING |
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DS21Q59LN+ | Analog Devices Inc./Maxim Integrated | 5000 | 70.01 |
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IC TELECOM INTERFACE 100LQFP |
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SI32178-B-GM1 | Skyworks Solutions Inc. | 5000 | 4.98 |
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IC TELECOM INTERFACE 42QFN |
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SI32192-A-ZM2R | Skyworks Solutions Inc. | 5000 | 1.26 |
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IC TELECOM INTERFACE |
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HC9P5504B-5ZX96 | Renesas Electronics America Inc | 5000 | 12.44 |
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IC TELECOM INTERFACE 24SOIC |
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PSB 21473 F V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE TQFP-144 |
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HC4P5509B-5 | Rochester Electronics, LLC | 5000 | 7.23 |
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ITU CO/LOOP CARRIER SLIC |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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