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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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MT8889CSR1 | Microchip Technology | 5000 | 4.86 |
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IC TELECOM INTERFACE 20SOIC |
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LE89810BSC | Microchip Technology | 5000 | 1.20 |
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IC TELECOM INTERFACE 16SOIC |
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SI3019-F-GT | Skyworks Solutions Inc. | 5000 | 11.75 |
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IC TELECOM INTERFACE 16TSSOP |
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PSB 21382 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-64 |
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HC9P5524-5 | Rochester Electronics, LLC | 5000 | 7.09 |
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EIA/ITU 24V PABX SLIC |
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BCM63168USP01 | Broadcom Limited | 5000 | 0.00 |
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63168U+6302+53124S+4360 |
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VSC8487YJU | Microchip Technology | 5000 | 66.66 |
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IC TELECOM INTERFACE |
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SI32280-A-GMR | Skyworks Solutions Inc. | 5000 | 4.87 |
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IC TELECOM INTERFACE 48QFN |
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LE9541CUQC | Microchip Technology | 5000 | 1.20 |
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IC TELECOM INTERFACE 40QFN |
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LE79Q2284MVC | Microchip Technology | 5000 | 12.09 |
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IC TELECOM INTERFACE 80LQFP |
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PSB 21383 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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NLXT300ZPE.F4 | Rochester Electronics, LLC | 5000 | 7.16 |
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FRAMER E1/T1 5V 28-PIN PLCC |
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BCM63168USR01 | Broadcom Limited | 5000 | 0.00 |
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63168U+6302 VDSL IAD |
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BCM68580XVB1IFSBG | Broadcom Limited | 5000 | 66.76 |
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10G XPON B-ONT CHIP |
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SI32285-A-GMR | Skyworks Solutions Inc. | 5000 | 4.89 |
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IC TELECOM INTERFACE 48QFN |
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PEF31001VSV12 | MaxLinear, Inc. | 5000 | 1.21 |
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CODEC |
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LE79Q2284MVCT | Microchip Technology | 5000 | 12.20 |
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IC TELECOM INTERFACE 80LQFP |
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PSB 21384 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-64 |
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PEF2054NV1.0 | Rochester Electronics, LLC | 5000 | 7.17 |
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TIME SLOT ASSIGNER |
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BCM63168USS01 | Broadcom Limited | 5000 | 0.00 |
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63168U+2X6302+6306(BONDING) |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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