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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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LE88231DLCT | Microchip Technology | 5000 | 10.49 |
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IC TELECOM INTERFACE 80LQFP |
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PEF 80902 H V1.1 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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PEF55218EV2.1-G | Rochester Electronics, LLC | 5000 | 6.35 |
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GEMINAX-A8+ MAX 8 CHANNEL ADSL2+ |
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BCM63168USAT01 | Broadcom Limited | 5000 | 0.00 |
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63168 30A CHIPSET |
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BCM68580XB1IFSBG | Broadcom Limited | 5000 | 58.44 |
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10G XPON HGW |
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LE87611NQC | Microchip Technology | 5000 | 0.92 |
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IC TELECOM INTERFACE 16QFN |
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SI32284-A-GMR | Skyworks Solutions Inc. | 5000 | 4.65 |
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IC TELECOM INTERFACE 48QFN |
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LE88241DLCT | Microchip Technology | 5000 | 10.49 |
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IC TELECOM INTERFACE 80LQFP |
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PEF 80912 H V1.4 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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PBL3764/4NSR2A | Rochester Electronics, LLC | 5000 | 6.42 |
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BIPOLAR SLIC, 2-4 CONVERSION |
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BCM63168USAU01 | Broadcom Limited | 5000 | 0.00 |
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63168 BONDING CHIPSET WITH GE |
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82V2048BBG | Renesas Electronics America Inc | 5000 | 59.07 |
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IC TELECOM INTERFACE 160BGA |
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LE87270NQC | Microchip Technology | 5000 | 0.95 |
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IC TELECOM INTERFACE 16QFN |
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SI32286-A-GMR | Skyworks Solutions Inc. | 5000 | 4.65 |
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IC TELECOM INTERFACE 56QFN |
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BCM63177A2UFKFEBG | Broadcom Limited | 5000 | 10.51 |
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VDSL 17A + 11AC WIFI 1GE + 4FE |
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PEF 82902 F V1.1 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE TQFP-64 |
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PEB3342HTV22XP | Rochester Electronics, LLC | 5000 | 6.51 |
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TELEPHONY INTERFACE CIRCUIT |
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BCM63168USAY01 | Broadcom Limited | 5000 | 0.00 |
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63168U+6302+43602+50210 |
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82V2048DAG | Renesas Electronics America Inc | 5000 | 59.07 |
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IC TELECOM INTERFACE 144TQFP |
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LE87270NQCT | Microchip Technology | 5000 | 0.95 |
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IC TELECOM INTERFACE 16QFN |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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