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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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PEF 3394 E V2.2 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE 176-LBGA |
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PSB7100ZDW-U2 | Rochester Electronics, LLC | 5000 | 6.00 |
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XWAY HIGH-END SINGLE-CHIP ADSL2/ |
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BCM63168ESI01 | Broadcom Limited | 5000 | 0.00 |
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63168E+6302X2+6406+53124S+ |
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VSC7421XJG-04 | Microchip Technology | 5000 | 56.54 |
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IC TELECOM INTERFACE 672HSBGA |
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LE58QL063HVCT | Microchip Technology | 5000 | 4.55 |
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IC TELECOM INTERFACE 64LQFP |
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ST7590T | STMicroelectronics | 5000 | 9.60 |
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IC TELECOM INTERFACE 100TQFP |
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PEF 3394 HL V2.2 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE 176-LBGA |
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PEB2070NV2.4GICC | Rochester Electronics, LLC | 5000 | 6.01 |
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ISDN COMMUNICATIONS CONTROLLER |
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BCM63168ESM01 | Broadcom Limited | 5000 | 0.00 |
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63168E WITH 2X2 11AC |
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ZL50019GAG2 | Microchip Technology | 5000 | 56.84 |
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IC TELECOM INTERFACE 256BGA |
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DS3680D | Rochester Electronics, LLC | 5000 | 0.52 |
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IC TELECOM INTERFACE 14SOIC |
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THS6226AIRHBR | Texas Instruments | 5000 | 3.85 |
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IC TELECOM INTERFACE 32VQFN |
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LE79112AKVCT | Microchip Technology | 5000 | 9.65 |
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IC TELECOM INTERFACE 128TQFP |
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PEF 3452 H V1.3 | Infineon Technologies | 5000 | 0.00 |
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IC TELECOM INTERFACE MQFP-44 |
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PEB2070NV2.4 | Rochester Electronics, LLC | 5000 | 6.01 |
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ISDN COMMUNICATIONS CONTROLLER |
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BCM63168SAE01 | Broadcom Limited | 5000 | 0.00 |
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63168 30A WITH 6303/6306 |
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BCM63153B1KFSBG | Broadcom Limited | 5000 | 56.93 |
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212, BONDED 106, V/ADSL, 10G GW |
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DS3680DE4 | Texas Instruments | 5000 | 0.70 |
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IC TELECOM INTERFACE 14SOIC |
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LE58QL021FJC | Microchip Technology | 5000 | 4.59 |
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IC TELECOM INTERFACE 44PLCC |
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BCM68461A1KRFBG | Broadcom Limited | 5000 | 9.73 |
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EPON/GPON HGU |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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